Processor (CPU)
CPU Name
Intel® Xeon® CPU W3503 @ 2.40GHz
Threading
1 CPU - 2 Core - 2 Threads
Frequency
2399.44 MHz (18 * 133.3 MHz) - Uncore: 2132.8 MHz
Multiplier
Current: 18 / Min: 12 / Max: 18
Architecture
Bloomfield / Stepping: D0 / Technology: 45 nm
CPUID / Ext.
6.A.5 / 6.1A
IA Extensions
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, EM64T, VT-x
Caches
L1D : 32 KB / L2 : 256 KB / L3 : 4096 KB
Caches Assoc.
L1D : 8-way / L2 : 8-way / L3 : 16-way
Microcode
Rev. 0x19
TDP / Vcore
130 Watts /
Temperature
44 °C / 111 °F
Type
Retail (Stock Frequency : 2400 MHz)
Cores Frequencies
#00: 2399.4 MHz  #01: 2399.4 MHz 
Motherboard
Model
Hewlett-Packard 0AE4h
Socket
Socket 1366 LGA
North Bridge
Intel X58 rev 13
South Bridge
Intel 82801JR (ICH10R) rev 00
BIOS
Hewlett-Packard 786G3 v01.06 (03/13/2009)
Memory (RAM)
Total Size
11264 MB
Type
Triple Channel (192 bit) DDR3-SDRAM
Frequency
533.2 MHz (DDR3-1066) - Ratio 2:8
Timings
7-7-7-19-2 (tCAS-tRCD-tRP-tRAS-tCR)
Slot #1 Module
Hyundai Electronics 4096 MB (DDR3-1337) - P/N: DMT451E6MFR8C-H9
Slot #2 Module
Hyundai Electronics 2048 MB (DDR3-1337) - P/N: HMT125U7BFR8C-H9
Slot #3 Module
Micron Technology 1024 MB (DDR3-1337) - P/N: 9JSF12872AY-1G4D1
Slot #4 Module
Avant Technology 4096 MB (DDR3-1337) - P/N: F6451U67F9333G
Graphic Card (GPU)
GPU Type
Radeon RX 560 Series
GPU Brand
ASUSTeK Computer Inc.
GPU VRAM
2048 MB
Storage (HDD/SSD)
Model #1 Name
CT250MX500SSD1 (FW: M3CR022)
Model #1 Capacity
232.9 GiB (~250 GB)
Model #1 Type
Fixed, SSD - Bus: RAID (8)
Model #2 Name
SAMSUNG HD502HI (FW: 1AG01118)
Model #2 Capacity
465.8 GiB (~500 GB)
Model #2 Type
Fixed - Bus: RAID (8)
Display
Screen #1
HSG1141 (HSP001C)
Screen #1 Spec
27.4 inches (69.6 cm) / 1920 x 1080 pixels @ 56-76 Hz
Miscellaneous
Windows Version
Microsoft Windows 10 (10.0) Professional 64-bit
CPU-Z Version
1.87.0 (64 bit)