Processor (CPU)
CPU Name
Intel® Xeon® CPU X5570 @ 2.93GHz
Threading
2 CPU - 8 Core - 16 Threads
Frequency
2932.65 MHz (22 * 133.3 MHz) - Uncore: 2666 MHz
Multiplier
Current: 22 / Min: 12 / Max: 25
Architecture
Gainestown / Stepping: D0 / Technology: 45 nm
CPUID / Ext.
6.A.5 / 6.1A
IA Extensions
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, EM64T, VT-x
Caches
L1D : 32 KB / L2 : 256 KB / L3 : 8192 KB
Caches Assoc.
L1D : 8-way / L2 : 8-way / L3 : 16-way
Microcode
Rev. 0x16
TDP / Vcore
95 Watts /
Temperature
60 °C / 140 °F
Type
Retail (Stock Frequency : 2933 MHz)
Cores Frequencies
#00: 2932.65 MHz  #01: 2932.65 MHz  #02: 2932.65 MHz  #03: 2932.65 MHz 
#04: 2932.65 MHz  #05: 2932.65 MHz  #06: 2932.65 MHz  #07: 2932.65 MHz 
Motherboard
Model
Unknown
Socket
Socket 1366 LGA
North Bridge
Intel 5520 rev 13
South Bridge
Intel 82801JR (ICH10R) rev 00
BIOS
HP P64 (05/05/2011)
Memory (RAM)
Total Size
131062 MB
Type
Triple Channel (192 bit) DDR3-SDRAM
Frequency
399.9 MHz (DDR3-800) - Ratio 2:6
Timings
6-6-6-16-1 (tCAS-tRCD-tRP-tRAS-tCR)
Slot #1 Module
Hyundai Electronics 8192 MB (DDR3-1337) - P/N: HMT31GR7CFR4C-H9
Slot #2 Module
Samsung 8192 MB (DDR3-1337) - P/N: M393B1K70CH0-CH9
Slot #3 Module
Hyundai Electronics 8192 MB (DDR3-1337) - P/N: HMT31GR7CFR4C-H9
Slot #4 Module
Samsung 8192 MB (DDR3-1337) - P/N: M393B1K70CH0-CH9
Slot #5 Module
Samsung 8192 MB (DDR3-1337) - P/N: M393B1K70CH0-CH9
Slot #6 Module
Samsung 8192 MB (DDR3-1337) - P/N: M393B1K70CH0-CH9
Graphic Card (GPU)
Storage (HDD/SSD)
Model #1
HP LOGICAL VOLUME
Capacity #1
480 GB
Miscellaneous
Windows Version
Microsoft Windows Server 2008 R2 Enterprise Edition (Full) 64-bit
CPU-Z Version
1.84.0 (64 bit)