Processor (CPU)
CPU Name
Intel® Xeon® CPU X5675 @ 3.07GHz
Threading
2 CPU - 12 Core - 24 Threads
Frequency
3199.25 MHz (24 * 133.3 MHz) - Uncore: 2666 MHz
Multiplier
Current: 24 / Min: 12 / Max: 26
Architecture
Westmere-EP / Stepping: B1 / Technology: 32 nm
CPUID / Ext.
6.C.2 / 6.2C
IA Extensions
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, EM64T, VT-x, AES
Caches
L1D : 32 KB / L2 : 256 KB / L3 : 12288 KB
Caches Assoc.
L1D : 8-way / L2 : 8-way / L3 : 16-way
Microcode
Rev. 0x1E
TDP / Vcore
95 Watts /
Temperature
55 °C / 131 °F
Type
Retail (Stock Frequency : 3066 MHz)
Cores Frequencies
#00: 3065.13 MHz  #01: 1599.63 MHz  #02: 1599.63 MHz  #03: 3065.95 MHz 
#04: 1599.63 MHz  #05: 1599.63 MHz  #06: 1599.63 MHz  #07: 1599.63 MHz 
#08: 1599.63 MHz  #09: 1599.63 MHz  #10: 1599.63 MHz  #11: 1599.63 MHz 
Motherboard
Model
Unknown
Socket
Socket 1366 LGA
North Bridge
Intel 5520 rev 13
South Bridge
Intel 82801JR (ICH10R) rev 00
BIOS
HP P67 (05/05/2011)
Memory (RAM)
Total Size
65536 MB
Type
Triple Channel (192 bit) DDR3-SDRAM
Frequency
399.9 MHz (DDR3-800) - Ratio 2:6
Timings
6-6-6-16-1 (tCAS-tRCD-tRP-tRAS-tCR)
Slot #1 Module
Samsung 4096 MB (DDR3-1337) - P/N: M393B5170EH1-CH9
Slot #2 Module
Samsung 4096 MB (DDR3-1337) - P/N: M393B5170EH1-CH9
Slot #3 Module
Samsung 4096 MB (DDR3-1337) - P/N: M393B5170EH1-CH9
Slot #4 Module
Samsung 4096 MB (DDR3-1337) - P/N: M393B5170EH1-CH9
Slot #5 Module
Samsung 4096 MB (DDR3-1337) - P/N: M393B5170EH1-CH9
Slot #6 Module
Samsung 4096 MB (DDR3-1337) - P/N: M393B5170EH1-CH9
Graphic Card (GPU)
GPU Type
Microsoft Basic Display Adapter
GPU Brand
Hewlett-Packard
Miscellaneous
Windows Version
Microsoft Windows Server (10.0) (0x4F) 64-bit
CPU-Z Version
1.88.0 (64 bit)