Processor (CPU)
CPU Name
Intel® Core™ i7-8700 CPU @ 3.20GHz
Threading
1 CPU - 6 Core - 12 Threads
Frequency
3192.96 MHz (32 * 99.78 MHz) - Uncore: 2993.4 MHz
Multiplier
Current: 32 / Min: 8 / Max: 46
Architecture
Coffee Lake / Stepping: U0 / Technology: 14 nm
CPUID / Ext.
6.E.A / 6.9E
IA Extensions
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, EM64T, VT-x, AES, AVX, AVX2, FMA3, TSX
Caches
L1D : 32 KB / L2 : 256 KB / L3 : 12288 KB
Caches Assoc.
L1D : 8-way / L2 : 4-way / L3 : 16-way
Microcode
Rev. 0xCA   ► Intel SA-00233 Patched ◄
TDP / Vcore
65 Watts / 0.976 Volts
Temperature
67 °C / 153 °F
Type
Retail (Stock Frequency : 3200 MHz)
Cores Frequencies
#00: 3193.0 MHz  #01: 3193.0 MHz  #02: 3193.0 MHz  #03: 3193.0 MHz 
#04: 3193.0 MHz  #05: 3193.0 MHz 
Motherboard
Model
BUGATEK H311-DS4
Socket
Socket 1151 LGA
North Bridge
Intel Coffee Lake rev 07
South Bridge
Intel H310 rev 00
BIOS
American Megatrends Inc. 5.12 (11/10/2025)
Memory (RAM)
Total Size
16384 MB
Type
Dual Channel (128 bit) DDR4-SDRAM
Frequency
1329.7 MHz (DDR4-2660) - Ratio 3:40
Timings
16-18-18-38-2 (tCAS-tRCD-tRP-tRAS-tCR)
Slot #1 Module
Crucial Technology 8192 MB (DDR4-2666) - XMP 2.0 - P/N: BLS8G4D26BFSBK.8FD
Slot #2 Module
Crucial Technology 8192 MB (DDR4-2666) - XMP 2.0 - P/N: BLS8G4D26BFSBK.8FD
Graphic Card (GPU)
GPU Type
NVIDIA GeForce RTX 3050 @ 1492 MHz
GPU Brand
Micro-Star International Co. Lt
GPU Specs
GA104-300 / Process: 8nm / Transistors: 13.2B / Die Size: 276 mm² / TDP: 130W
GPU Units
Shader Units: 2560 / Texture Units (TMU): 80 / Render Units (ROP): 32
GPU VRAM
6144 MB GDDR6 / 128-bit Bus @ 7001 MHz (Micron)
GPU APIs
DirectX 12.0 (12_2) / OpenGL 4.6 / OpenCL 3.0 / Vulkan 1.3
Storage (HDD/SSD)
Model #1 Name
SAMSUNG MZVL4512HBLU-00BH1 (FW: HPS3NHAV)
Model #1 Capacity
476.9 GiB (~510 GB)
Model #1 Type
Fixed, SSD - Bus: NVMe (17)
Display
Screen #1
SONY SONY TV *02 (SNYCA03)
Screen #1 Spec
65 inches (165.1 cm) / 1920 x 1080 pixels @ 48-62 Hz
Miscellaneous
Windows Version
Microsoft Windows 10 (0xBF) (x64)
CPU-Z Version
2.16.0 (64 bit)