Processor (CPU)
CPU Name
AMD Ryzen 9 5900HX with Radeon Graphics
Threading
1 CPU - 8 Core - 16 Threads
Frequency
4715.92 MHz (47.25 * 99.81 MHz) - Uncore: 1596.9 MHz
Multiplier
Current: 47.25
Architecture
Cezanne / Stepping: CZN-A0 / Technology: 7 nm
CPUID / Ext.
F.0.0 / 19.50
IA Extensions
MMX(+), SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A, x86-64, AES, AVX, AVX2, FMA3, SHA
Caches
L1D : 32 KB / L2 : 512 KB / L3 : 16384 KB
Caches Assoc.
L1D : 8-way / L2 : 8-way / L3 : 16-way
Microcode
Rev. 0xA50000C
TDP / Vcore
45 Watts / 1.337 Volts
Temperature
66.8 °C / 152 °F
Type
Retail
Cores Frequencies
#00: 4715.92 MHz  #01: 4715.92 MHz  #02: 4715.92 MHz  #03: 4715.92 MHz 
#04: 4690.97 MHz  #05: 4715.92 MHz  #06: 4715.92 MHz  #07: 4715.92 MHz 
Motherboard
Model
MECHREVO GM7ZG7M
Socket
Socket FP6
North Bridge
AMD Ryzen SOC rev 00
South Bridge
AMD FCH rev 51
BIOS
American Megatrends International LLC. N.1.24MRO10 (09/15/2021)
Memory (RAM)
Total Size
32768 MB
Type
Dual Channel (128 bit) DDR4-SDRAM
Frequency
1596.5 MHz (DDR4-3194) - Ratio 1:16
Timings
17-19-19-39-58-1 (tCAS-tRCD-tRP-tRAS-tRC-tCR)
Slot #1 Module
SK Hynix 16384 MB (DDR4-3200) - P/N: HMAA2GS6CJR8N-XN
Slot #2 Module
SK Hynix 16384 MB (DDR4-3200) - P/N: HMAA2GS6CJR8N-XN
Graphic Card (GPU)
GPU #1 Type
NVIDIA GeForce RTX 3070 Laptop GPU (GA104) @ 1620 MHz
GPU #1 Brand
TONGFANG HONGKONG Ltd
GPU #1 VRAM
8192 MB @ 7001 MHz
GPU #2 Type
AMD Radeon(TM) Graphics (Vega)
GPU #2 Brand
TONGFANG HONGKONG Ltd
GPU #2 VRAM
768 MB
Storage (HDD/SSD)
Model #1 Name
SAMSUNG MZVL2512HCJQ-00B07 (FW: GXA7602Q)
Model #1 Capacity
476.9 GiB (~510 GB)
Model #1 Type
Fixed, SSD - Bus: NVMe (17)
Model #2 Name
SAMSUNG MZVLB1T0HALR-00000 (FW: EXA7301Q)
Model #2 Capacity
953.9 GiB (~1020 GB)
Model #2 Type
Fixed, SSD - Bus: NVMe (17)
Miscellaneous
Windows Version
Microsoft Windows 11 (10.0) Professional 64-bit
CPU-Z Version
2.03.0 (64 bit)