Processor (CPU)
CPU Name
Intel® Core™ i7-8700 CPU @ 3.20GHz
Threading
1 CPU - 6 Core - 12 Threads
Frequency
4289.51 MHz (43 * 99.76 MHz) - Uncore: 3192.2 MHz
Multiplier
Current: 43 / Min: 8 / Max: 46
Architecture
Coffee Lake / Stepping: U0 / Technology: 14 nm
CPUID / Ext.
6.E.A / 6.9E
IA Extensions
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, EM64T, VT-x, AES, AVX, AVX2, FMA3, TSX
Caches
L1D : 32 KB / L2 : 256 KB / L3 : 12288 KB
Caches Assoc.
L1D : 8-way / L2 : 4-way / L3 : 16-way
Microcode
Rev. 0x70   ► Intel SA-00233 Vulnerable ◄
TDP / Vcore
65 Watts / 0.988 Volts
Temperature
75 °C / 167 °F
Type
Retail (Stock Frequency : 3200 MHz)
Cores Frequencies
#00: 4289.51 MHz  #01: 4289.51 MHz  #02: 4289.51 MHz  #03: 4289.51 MHz 
#04: 3192.19 MHz  #05: 3591.22 MHz 
Motherboard
Model
Notebook P7xxTM
Socket
Socket 1151 LGA
North Bridge
Intel Coffee Lake rev 07
South Bridge
Intel Z370 rev 00
BIOS
American Megatrends Inc. 5.12 (10/20/2017)
Memory (RAM)
Total Size
24576 MB
Type
Dual Channel (128 bit) DDR4-SDRAM
Frequency
1329.5 MHz (DDR4-2660) - Ratio 1:20
Timings
19-19-19-43-2 (tCAS-tRCD-tRP-tRAS-tCR)
Slot #1 Module
Micron Technology 8192 MB (DDR4-2662) - P/N: 8ATF1G64HZ-2G6H1
Slot #2 Module
Micron Technology 16384 MB (DDR4-2662) - P/N: 16ATF2G64HZ-2G6E1
Graphic Card (GPU)
GPU Type
NVIDIA GeForce GTX 1070 (GP104) @ 139 MHz
GPU Brand
Clevo
GPU Specs
GP104-200 / Process: 16nm / Transistors: 7.2B / Die Size: 314 mm² / TDP: 150W
GPU Units
Shader Units: 1920 / Texture Units (TMU): 120 / Render Units (ROP): 64
GPU VRAM
8192 MB GDDR5 / 256-bit Bus @ 405 MHz (Samsung)
GPU APIs
DirectX 12.0 (12_1) / OpenGL 4.6 / OpenCL 1.2 / Vulkan 1.1
Storage (HDD/SSD)
Model #1 Name
SAMSUNG MZVKW512HMJP-00000
Model #1 Capacity
476.9 GiB (~510 GB)
Model #1 Type
Fixed - Bus: NVMe (17)
Model #2 Name
HGST HTS721010A9E630 (FW: JB0OA3U0)
Model #2 Capacity
931.5 GiB (~1000 GB)
Model #2 Type
Fixed - Bus: SATA (11)
Miscellaneous
Windows Version
Microsoft Windows 10 (10.0) Education 64-bit
CPU-Z Version
1.87.0 (64 bit)