Processor (CPU)
CPU Name
Mobile AMD Sempron™
Threading
1 CPU - 1 Core - 1 Threads
Frequency
1807.96 MHz (9 * 200.88 MHz)
Multiplier
Current: 9 / Max: 9
Architecture
Keene / Stepping: DH-F2 / Technology: 90 nm
CPUID / Ext.
F.C.2 / F.4C
IA Extensions
MMX(+), 3DNow!(+), SSE, SSE2, SSE3, x86-64
Caches
L1D : 64 KB / L2 : 256 KB
Caches Assoc.
L1D : 2-way / L2 : 16-way
Vcore
1.15 Volts
Temperature
42 °C / 108 °F
Type
Retail (Stock Frequency : 1800 MHz)
Motherboard
Model
Wistron 30B5
Socket
Socket S1 (638)
North Bridge
AMD K8 Bridge rev 00
South Bridge
NVIDIA nForce 410/430 MCP rev A3
BIOS
Hewlett-Packard F.3D (04/21/2009)
Memory (RAM)
Total Size
2048 MB
Type
Single Channel (64 bit) DDR2-SDRAM
Frequency
301.3 MHz (DDR2-602) - Ratio
Timings
5-5-5-15-21-2 (tCAS-tRCD-tRP-tRAS-tRC-tCR)
Slot #1 Module
Samsung 1024 MB (DDR2-800) - P/N: M4 70T2864QZ3-CF7
Slot #2 Module
Samsung 1024 MB (DDR2-662) - P/N: M4 70T2953EZ3-CE6
Graphic Card (GPU)
Miscellaneous
Windows Version
Microsoft Windows 7 (6.1) Ultimate Edition 64-bit
CPU-Z Version
1.93.0 (64 bit)