Processor (CPU)
CPU Name
Intel® Core™ i3 CPU 550 @ 3.20GHz
Threading
1 CPU - 2 Core - 4 Threads
Frequency
2526.62 MHz (19 * 132.98 MHz) - Uncore: 2127.7 MHz
Multiplier
Current: 19 / Min: 9 / Max: 24
Architecture
Clarkdale / Stepping: K0 / Technology: 32 nm
CPUID / Ext.
6.5.5 / 6.25
IA Extensions
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, EM64T, VT-x
Caches
L1D : 32 KB / L2 : 256 KB / L3 : 4096 KB
Caches Assoc.
L1D : 8-way / L2 : 8-way / L3 : 16-way
Microcode
Rev. 0x2
TDP / Vcore
73 Watts / 1.224 Volts
Temperature
104 °C / 219 °F
Type
Retail (Stock Frequency : 3200 MHz)
Cores Frequencies
#00: 2526.62 MHz  #02: 2792.58 MHz 
Motherboard
Model
Foxconn H55MXV Series
Socket
Socket 1156 LGA
North Bridge
Intel Havendale/Clarkdale Host Bridge re
South Bridge
Intel H55 rev 06
BIOS
American Megatrends Inc. 080015 (07/22/2010)
Memory (RAM)
Total Size
4096 MB
Type
Single Channel (64 bit) DDR3-SDRAM
Frequency
664.9 MHz (DDR3-1330) - Ratio 4:20
Timings
9-9-9-24-1 (tCAS-tRCD-tRP-tRAS-tCR)
Slot #1 Module
4096 MB (DDR3-1337)
Graphic Card (GPU)
GPU Type
ATI Radeon HD 4800 Series (RV770) @ 575 MHz
GPU Brand
PC Partner
GPU VRAM
1024 MB @ 900 MHz
Storage (HDD/SSD)
Model #1
Hitachi HDS721010CLA332
Capacity #1
1000 GB
Model #2
TOSHIBA External USB 3.0
Capacity #2
2000 GB
Display
Screen #1
Samsung SMS23A550H (SAM07CA)
Screen #1 Spec
23.1 inches (58.7 cm) / 1920 x 1080 pixels @ 50-75 Hz
Miscellaneous
Windows Version
Microsoft Windows 7 (6.1) Professional 64-bit
CPU-Z Version
1.80.0 (64 bit)