Processor (CPU)
CPU Name
Intel® Core™ i3 CPU M 370 @ 2.40GHz
Threading
1 CPU - 2 Core - 4 Threads
Frequency
2393 MHz (18 * 133 MHz)
Multiplier
Current: 18 / Min: 7 / Max: 18
Architecture
Arrandale / Stepping: K0 / Technology: 32 nm
CPUID / Ext.
6.5.5 / 6.25
IA Extensions
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, EM64T, VT-x
Caches
L1D : 32 KB / L2 : 256 KB / L3 : 3072 KB
Caches Assoc.
L1D : 8-way / L2 : 8-way / L3 : 12-way
Microcode
Rev. 0x7
TDP / Vcore
25 Watts /
Temperature
77 °C / 171 °F
Type
Retail (Stock Frequency : 2400 MHz)
Cores Frequencies
#00: 2393.0 MHz  #01: 2393.0 MHz 
Motherboard
Model
Hewlett-Packard 1693
Socket
Socket 989 rPGA
North Bridge
Intel Havendale/Clarkdale Host Bridge re
South Bridge
Intel HM55 rev 05
BIOS
Hewlett-Packard F.34 (06/14/2012)
Memory (RAM)
Total Size
4096 MB
Type
Dual Channel (128 bit) DDR3-SDRAM
Frequency
531.8 MHz (DDR3-1064) - Ratio 4:16
Timings
7-7-7-20-1 (tCAS-tRCD-tRP-tRAS-tCR)
Slot #1 Module
Elpida 2048 MB (DDR3-1062) - P/N: EBJ21UE8BDS0-AE-F
Slot #2 Module
Samsung 2048 MB (DDR3-1337) - P/N: M471B5773DH0-CH9
Graphic Card (GPU)
GPU Type
Intel(R) HD Graphics
GPU Brand
Hewlett-Packard
GPU VRAM
64 MB
Storage (HDD/SSD)
Model #1 Name
SAMSUNG MZNLN128HAHQ-000H1 (FW: MVT24H3Q)
Model #1 Capacity
119.2 GiB (~130 GB)
Model #1 Type
Fixed, SSD - Bus: SATA (11)
Miscellaneous
Windows Version
Microsoft Windows 10 Professional (x64)
CPU-Z Version
2.18.0 (64 bit)