Processor (CPU)
CPU Name
Intel® Core™ i3 CPU M 370 @ 2.40GHz
Threading
1 CPU - 2 Core - 2 Threads
Frequency
6650.8 MHz (50 * 133.02 MHz)
Multiplier
Current: 50 / Min: 7 / Max: 18
Architecture
Arrandale / Stepping: K0 / Technology: 32 nm
CPUID / Ext.
6.5.5 / 6.25
IA Extensions
MMX, SSE (1, 2, 3, 3S, 4.1, 4.2), EM64T, VT-x
Caches
L1D : 32 KB / L2 : 256 KB / L3 : 3072 KB
Caches Assoc.
L1D : 8-way / L2 : 8-way / L3 : 12-way
L1 Data Cache
-
L1 Inst. Cache
-
L2 Cache
-
L3 Cache
-
Microcode
Rev. 0x2
TDP / Vcore
25 Watts /
Temperature
48 °C / 118 °F
Type
Retail (Stock Frequency : 2400 MHz)
Motherboard
Model
SAMSUNG ELECTRONICS CO. LTD. R428/R439
Socket
Socket 989 rPGA
North Bridge
Intel Havendale/Clarkdale Host Bridge re
South Bridge
Intel HM55 rev 05
BIOS
Phoenix Technologies Ltd. 06UY.M002.20100719.XW (07/19/2010)
Memory (RAM)
Total Size
4096 MB
Type
Dual Channel (128 bit) DDR3-SDRAM
Frequency
532.1 MHz (DDR3-1064) - Ratio 4:16
Timings
7-7-7-20 (tCAS-tRCD-tRP-tRAS)
Slot #1 Module
Samsung 2048 MB (DDR3-1062)
Slot #2 Module
Kingston 2048 MB (DDR3-1062)
Graphic Card (GPU)
GPU Type
Intel(R) HD Graphics
GPU VRAM
1530 MB
Storage (HDD/SSD)
Model #1
Hitachi HTS545050B9A300
Capacity #1
500 GB
Miscellaneous
Windows Version
Microsoft Windows 7 (6.1) Ultimate Edition 32-bit
CPU-Z Version
1.67.1 (32 bit)